Global 3D IC and 2.5D IC Packaging Market Size By Segmentations, Top Key Players, Trend, Future Development & Forecast 2024-2035
- PUBLISHED ON
- 11/23/2022
- NO OF PAGES
- 286
- CATEGORY
- Packaging
The competitive landscape analysis of 3D IC and 2.5D IC Packaging Market uncovers detailed company profiles, revenue shares, portfolio innovations, regional product footprint, key developmental strategies, pricing structure, target markets, and near-term plans of market leaders. This entire section helps readers gain an essence of what is driving competition and what would help them stand out to win new target markets.
Market estimates and forecast are backed by an extensive primary research, further complemented by on-point secondary research of 3D IC and 2.5D IC Packaging Market. The research analysts have invested significant time and effort in gathering critical industry information from KIPs such as OEMs, top suppliers and distributors, and government bodies.
Market Segmentations:
The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2022 to 2030. by Application segment also provides consumption during the forecast period of 2022 to 2030. Understanding the segments helps in identifying the importance of different factors that aid the market growth.
Global 3D IC and 2.5D IC Packaging Market: By Types
3D wafer-level chip-scale packaging
3D TSV
2.5D
Global 3D IC and 2.5D IC Packaging Market: By Applications
Logic
Imaging & optoelectronics
Memory
MEMS/sensors
LED
Power
Global 3D IC and 2.5D IC Packaging Market: Top Key Players
Taiwan Semiconductor
Samsung Electronics
Toshiba Corp
Advanced Semiconductor Engineering
Amkor Technology
Global 3D IC and 2.5D IC Packaging Market: Regions
North America
Europe
China
Japan
South Korea
Global 3D IC and 2.5D IC Packaging Market: Regions/Countries
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
U.A.E
Global 3D IC and 2.5D IC Packaging Market: Market Size Estimation
Both the top-down and bottom-up approaches were used to estimate and validate the size of the market and to estimate the size of various other dependent sub-markets of various marketspaces. The key players in the markets are identified through secondary research, and their market contributions in different applications across regions and globally were determined through primary and secondary research. This entire process included the study of the annual and financial reports of the top market players and extensive interviews for key insights with industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares, splits, and breakdowns were determined using secondary sources and verified through primary sources. All the possible parameters that affect the market covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analysed to arrive at the final quantitative and qualitative data. This data has been consolidated, and detailed inputs and analysis from Analytics Market Research added before being presented in this report.
Reasons to Purchase 3D IC and 2.5D IC Packaging Market Report
• Qualitative and quantitative analysis of the market based on segmentation involving both economic as well as non-economic factors
• Provision of market value (USD Billion) data for each segment and sub-segment
• Indicates the region and segment that is expected to witness the fastest growth as well as to dominate the market
• Analysis by geography highlighting the consumption of the product/service in the region as well as indicating the factors that are affecting the market within each region
• Competitive landscape which incorporates the market ranking of the major players, along with new service/product launches, partnerships, business expansions, and acquisitions in the past five years of companies profiled
• Extensive company profiles comprising of company overview, company insights, product benchmarking, and SWOT analysis for the major market players
• The current as well as the future market outlook of the industry with respect to recent developments which involve growth opportunities and drivers as well as challenges and restraints of both emerging as well as developed regions
• Includes in-depth analysis of the market of various perspectives through Porter’s five forces analysis
• Provides insight into the market through Value Chain
• Market dynamics scenario, along with growth opportunities of the market in the years to come
Frequently Asked Questions
• What is the market size and growth projections?
• What is the market size and growth projection for each of the market segments and sub-segments across Countries & Regions?
• What are the top performing segments, and countries / regions of each of the markets?
• What is the market size and growth rate across key countries / regions?
• How big is the global & regional market in terms of revenue and volume?
• How far market will grow in forecast period in terms of revenue and volume?
• What factors will influence demand and supply trends across each markets during the forecast period?
• What are the technology trends shaping various markets?
• Which country / region has more opportunities?
• What is the COVID-19 impact on the market and how long will it take to recover?
• Who are the key competitors of market Players?
• What are the market share (%) of Key Players?
• What are the Merger & Acquisition, New Product Launch, Recent Development within each of the Markets?
• What are PEST analysis, Ecosystem Analysis, Porter's Five Forecast Analysis, Ansoff Matrix, and SWOT Analysis among other analyses for diverse markets?
Base Year: 2023Market estimates and forecast are backed by an extensive primary research, further complemented by on-point secondary research of 3D IC and 2.5D IC Packaging Market. The research analysts have invested significant time and effort in gathering critical industry information from KIPs such as OEMs, top suppliers and distributors, and government bodies.
Market Segmentations:
The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2022 to 2030. by Application segment also provides consumption during the forecast period of 2022 to 2030. Understanding the segments helps in identifying the importance of different factors that aid the market growth.
Global 3D IC and 2.5D IC Packaging Market: By Types
3D wafer-level chip-scale packaging
3D TSV
2.5D
Global 3D IC and 2.5D IC Packaging Market: By Applications
Logic
Imaging & optoelectronics
Memory
MEMS/sensors
LED
Power
Global 3D IC and 2.5D IC Packaging Market: Top Key Players
Taiwan Semiconductor
Samsung Electronics
Toshiba Corp
Advanced Semiconductor Engineering
Amkor Technology
Global 3D IC and 2.5D IC Packaging Market: Regions
North America
Europe
China
Japan
South Korea
Global 3D IC and 2.5D IC Packaging Market: Regions/Countries
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
U.A.E
Global 3D IC and 2.5D IC Packaging Market: Market Size Estimation
Both the top-down and bottom-up approaches were used to estimate and validate the size of the market and to estimate the size of various other dependent sub-markets of various marketspaces. The key players in the markets are identified through secondary research, and their market contributions in different applications across regions and globally were determined through primary and secondary research. This entire process included the study of the annual and financial reports of the top market players and extensive interviews for key insights with industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares, splits, and breakdowns were determined using secondary sources and verified through primary sources. All the possible parameters that affect the market covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analysed to arrive at the final quantitative and qualitative data. This data has been consolidated, and detailed inputs and analysis from Analytics Market Research added before being presented in this report.
Reasons to Purchase 3D IC and 2.5D IC Packaging Market Report
• Qualitative and quantitative analysis of the market based on segmentation involving both economic as well as non-economic factors
• Provision of market value (USD Billion) data for each segment and sub-segment
• Indicates the region and segment that is expected to witness the fastest growth as well as to dominate the market
• Analysis by geography highlighting the consumption of the product/service in the region as well as indicating the factors that are affecting the market within each region
• Competitive landscape which incorporates the market ranking of the major players, along with new service/product launches, partnerships, business expansions, and acquisitions in the past five years of companies profiled
• Extensive company profiles comprising of company overview, company insights, product benchmarking, and SWOT analysis for the major market players
• The current as well as the future market outlook of the industry with respect to recent developments which involve growth opportunities and drivers as well as challenges and restraints of both emerging as well as developed regions
• Includes in-depth analysis of the market of various perspectives through Porter’s five forces analysis
• Provides insight into the market through Value Chain
• Market dynamics scenario, along with growth opportunities of the market in the years to come
Frequently Asked Questions
• What is the market size and growth projections?
• What is the market size and growth projection for each of the market segments and sub-segments across Countries & Regions?
• What are the top performing segments, and countries / regions of each of the markets?
• What is the market size and growth rate across key countries / regions?
• How big is the global & regional market in terms of revenue and volume?
• How far market will grow in forecast period in terms of revenue and volume?
• What factors will influence demand and supply trends across each markets during the forecast period?
• What are the technology trends shaping various markets?
• Which country / region has more opportunities?
• What is the COVID-19 impact on the market and how long will it take to recover?
• Who are the key competitors of market Players?
• What are the market share (%) of Key Players?
• What are the Merger & Acquisition, New Product Launch, Recent Development within each of the Markets?
• What are PEST analysis, Ecosystem Analysis, Porter's Five Forecast Analysis, Ansoff Matrix, and SWOT Analysis among other analyses for diverse markets?
Historic Year: 2016-2022
Forecast: 2024-2035
1 3D IC and 2.5D IC Packaging Market Overview
1.1 Product Overview and Scope of 3D IC and 2.5D IC Packaging
1.2 3D IC and 2.5D IC Packaging Segment by Type
1.2.1 Global 3D IC and 2.5D IC Packaging Market Size Growth Rate Analysis by Type 2022 VS 2030
1.2.2 3D wafer-level chip-scale packaging
1.2.3 3D TSV
1.2.4 2.5D
1.3 3D IC and 2.5D IC Packaging Segment by Application
1.3.1 Global 3D IC and 2.5D IC Packaging Consumption Comparison by Application: 2016 VS 2021 VS 2030
1.3.2 Logic
1.3.3 Imaging & optoelectronics
1.3.4 Memory
1.3.5 MEMS/sensors
1.3.6 LED
1.3.7 Power
1.4 Global Market Growth Prospects
1.4.1 Global 3D IC and 2.5D IC Packaging Revenue Estimates and Forecasts (2016-2030)
1.4.2 Global 3D IC and 2.5D IC Packaging Production Estimates and Forecasts (2016-2030)
1.5 Global 3D IC and 2.5D IC Packaging Market by Region
1.5.1 Global 3D IC and 2.5D IC Packaging Market Size Estimates and Forecasts by Region: 2016 VS 2021 VS 2030
1.5.2 North America 3D IC and 2.5D IC Packaging Estimates and Forecasts (2016-2030)
1.5.3 Europe 3D IC and 2.5D IC Packaging Estimates and Forecasts (2016-2030)
1.5.5 China 3D IC and 2.5D IC Packaging Estimates and Forecasts (2016-2030)
1.5.5 Japan 3D IC and 2.5D IC Packaging Estimates and Forecasts (2016-2030)
1.5.6 South Korea 3D IC and 2.5D IC Packaging Estimates and Forecasts (2016-2030)
2 Market Competition by Manufacturers
2.1 Global 3D IC and 2.5D IC Packaging Production Market Share by Manufacturers (2016-2021)
2.2 Global 3D IC and 2.5D IC Packaging Revenue Market Share by Manufacturers (2016-2021)
2.3 3D IC and 2.5D IC Packaging Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.4 Global 3D IC and 2.5D IC Packaging Average Price by Manufacturers (2016-2021)
2.5 Manufacturers 3D IC and 2.5D IC Packaging Production Sites, Area Served, Product Types
2.6 3D IC and 2.5D IC Packaging Market Competitive Situation and Trends
2.6.1 3D IC and 2.5D IC Packaging Market Concentration Rate
2.6.2 Global 5 and 10 Largest 3D IC and 2.5D IC Packaging Players Market Share by Revenue
2.6.3 Mergers & Acquisitions, Expansion
3 Production and Capacity by Region
3.1 Global Production of 3D IC and 2.5D IC Packaging Market Share by Region (2016-2021)
3.2 Global 3D IC and 2.5D IC Packaging Revenue Market Share by Region (2016-2021)
3.3 Global 3D IC and 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
3.4 North America 3D IC and 2.5D IC Packaging Production
3.4.1 North America 3D IC and 2.5D IC Packaging Production Growth Rate (2016-2021)
3.4.2 North America 3D IC and 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
3.5 Europe 3D IC and 2.5D IC Packaging Production
3.5.1 Europe 3D IC and 2.5D IC Packaging Production Growth Rate (2016-2021)
3.5.2 Europe 3D IC and 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
3.6 China 3D IC and 2.5D IC Packaging Production
3.6.1 China 3D IC and 2.5D IC Packaging Production Growth Rate (2016-2021)
3.6.2 China 3D IC and 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
3.7 Japan 3D IC and 2.5D IC Packaging Production
3.7.1 Japan 3D IC and 2.5D IC Packaging Production Growth Rate (2016-2021)
3.7.2 Japan 3D IC and 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
3.8 South Korea 3D IC and 2.5D IC Packaging Production
3.8.1 South Korea 3D IC and 2.5D IC Packaging Production Growth Rate (2016-2021)
3.8.2 South Korea 3D IC and 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
4 Global 3D IC and 2.5D IC Packaging Consumption by Region
4.1 Global 3D IC and 2.5D IC Packaging Consumption by Region
4.1.1 Global 3D IC and 2.5D IC Packaging Consumption by Region
4.1.2 Global 3D IC and 2.5D IC Packaging Consumption Market Share by Region
4.2 North America
4.2.1 North America 3D IC and 2.5D IC Packaging Consumption by Country
4.2.2 U.S.
4.2.3 Canada
4.3 Europe
4.3.1 Europe 3D IC and 2.5D IC Packaging Consumption by Country
4.3.2 Germany
4.3.3 France
4.3.4 U.K.
4.3.5 Italy
4.3.6 Russia
4.4 Asia Pacific
4.4.1 Asia Pacific 3D IC and 2.5D IC Packaging Consumption by Region
4.4.2 China
4.4.3 Japan
4.4.4 South Korea
4.4.5 Taiwan
4.4.6 Southeast Asia
4.4.7 India
4.4.8 Australia
4.5 Latin America
4.5.1 Latin America 3D IC and 2.5D IC Packaging Consumption by Country
4.5.2 Mexico
4.5.3 Brazil
5 Production, Revenue, Price Trend by Type
5.1 Global 3D IC and 2.5D IC Packaging Production Market Share by Type (2016-2021)
5.2 Global 3D IC and 2.5D IC Packaging Revenue Market Share by Type (2016-2021)
5.3 Global 3D IC and 2.5D IC Packaging Price by Type (2016-2021)
6 Consumption Analysis by Application
6.1 Global 3D IC and 2.5D IC Packaging Consumption Market Share by Application (2016-2021)
6.2 Global 3D IC and 2.5D IC Packaging Consumption Growth Rate by Application (2016-2021)
7 Key Companies Profiled
7.1 Taiwan Semiconductor
7.1.1 Taiwan Semiconductor 3D IC and 2.5D IC Packaging Corporation Information
7.1.2 Taiwan Semiconductor 3D IC and 2.5D IC Packaging Product Portfolio
7.1.3 Taiwan Semiconductor 3D IC and 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
7.1.4 Taiwan Semiconductor Main Business and Markets Served
7.1.5 Taiwan Semiconductor Recent Developments/Updates
7.2 Samsung Electronics
7.2.1 Samsung Electronics 3D IC and 2.5D IC Packaging Corporation Information
7.2.2 Samsung Electronics 3D IC and 2.5D IC Packaging Product Portfolio
7.2.3 Samsung Electronics 3D IC and 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
7.2.4 Samsung Electronics Main Business and Markets Served
7.2.5 Samsung Electronics Recent Developments/Updates
7.3 Toshiba Corp
7.3.1 Toshiba Corp 3D IC and 2.5D IC Packaging Corporation Information
7.3.2 Toshiba Corp 3D IC and 2.5D IC Packaging Product Portfolio
7.3.3 Toshiba Corp 3D IC and 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
7.3.4 Toshiba Corp Main Business and Markets Served
7.3.5 Toshiba Corp Recent Developments/Updates
7.4 Advanced Semiconductor Engineering
7.4.1 Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Corporation Information
7.4.2 Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Product Portfolio
7.4.3 Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
7.4.4 Advanced Semiconductor Engineering Main Business and Markets Served
7.4.5 Advanced Semiconductor Engineering Recent Developments/Updates
7.5 Amkor Technology
7.5.1 Amkor Technology 3D IC and 2.5D IC Packaging Corporation Information
7.5.2 Amkor Technology 3D IC and 2.5D IC Packaging Product Portfolio
7.5.3 Amkor Technology 3D IC and 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
7.5.4 Amkor Technology Main Business and Markets Served
7.5.5 Amkor Technology Recent Developments/Updates
8 3D IC and 2.5D IC Packaging Manufacturing Cost Analysis
8.1 3D IC and 2.5D IC Packaging Key Raw Materials Analysis
8.1.1 Key Raw Materials
8.1.2 Key Raw Materials Price Trend
8.1.3 Key Suppliers of Raw Materials
8.2 Proportion of Manufacturing Cost Structure
8.3 Manufacturing Process Analysis of 3D IC and 2.5D IC Packaging
8.4 3D IC and 2.5D IC Packaging Industrial Chain Analysis
9 Marketing Channel, Distributors and Customers
9.1 Marketing Channel
9.2 3D IC and 2.5D IC Packaging Distributors List
9.3 3D IC and 2.5D IC Packaging Customers
10 Market Dynamics
10.1 3D IC and 2.5D IC Packaging Industry Trends
10.2 3D IC and 2.5D IC Packaging Growth Drivers
10.3 3D IC and 2.5D IC Packaging Market Challenges
10.4 3D IC and 2.5D IC Packaging Market Restraints
11 Production and Supply Forecast
11.1 Global Forecasted Production of 3D IC and 2.5D IC Packaging by Region (2022-2030)
11.2 North America 3D IC and 2.5D IC Packaging Production, Revenue Forecast (2022-2030)
11.3 Europe 3D IC and 2.5D IC Packaging Production, Revenue Forecast (2022-2030)
11.4 China 3D IC and 2.5D IC Packaging Production, Revenue Forecast (2022-2030)
11.5 Japan 3D IC and 2.5D IC Packaging Production, Revenue Forecast (2022-2030)
11.6 South Korea 3D IC and 2.5D IC Packaging Production, Revenue Forecast (2022-2030)
12 Consumption and Demand Forecast
12.1 Global Forecasted Demand Analysis of 3D IC and 2.5D IC Packaging
12.2 North America Forecasted Consumption of 3D IC and 2.5D IC Packaging by Country
12.3 Europe Market Forecasted Consumption of 3D IC and 2.5D IC Packaging by Country
12.4 Asia Pacific Market Forecasted Consumption of 3D IC and 2.5D IC Packaging by Region
12.5 Latin America Forecasted Consumption of 3D IC and 2.5D IC Packaging by Country
13 Forecast by Type and by Application (2022-2030)
13.1 Global Production, Revenue and Price Forecast by Type (2022-2030)
13.1.1 Global Forecasted Production of 3D IC and 2.5D IC Packaging by Type (2022-2030)
13.1.2 Global Forecasted Revenue of 3D IC and 2.5D IC Packaging by Type (2022-2030)
13.1.3 Global Forecasted Price of 3D IC and 2.5D IC Packaging by Type (2022-2030)
13.2 Global Forecasted Consumption of 3D IC and 2.5D IC Packaging by Application (2022-2030)
14 Research Finding and Conclusion
15 Methodology and Data Source
15.1 Methodology/Research Approach
15.1.1 Research Programs/Design
15.1.2 Market Size Estimation
15.1.3 Market Breakdown and Data Triangulation
15.2 Data Source
15.2.1 Secondary Sources
15.2.2 Primary Sources
15.3 Author List
15.4 Disclaimer
1.1 Product Overview and Scope of 3D IC and 2.5D IC Packaging
1.2 3D IC and 2.5D IC Packaging Segment by Type
1.2.1 Global 3D IC and 2.5D IC Packaging Market Size Growth Rate Analysis by Type 2022 VS 2030
1.2.2 3D wafer-level chip-scale packaging
1.2.3 3D TSV
1.2.4 2.5D
1.3 3D IC and 2.5D IC Packaging Segment by Application
1.3.1 Global 3D IC and 2.5D IC Packaging Consumption Comparison by Application: 2016 VS 2021 VS 2030
1.3.2 Logic
1.3.3 Imaging & optoelectronics
1.3.4 Memory
1.3.5 MEMS/sensors
1.3.6 LED
1.3.7 Power
1.4 Global Market Growth Prospects
1.4.1 Global 3D IC and 2.5D IC Packaging Revenue Estimates and Forecasts (2016-2030)
1.4.2 Global 3D IC and 2.5D IC Packaging Production Estimates and Forecasts (2016-2030)
1.5 Global 3D IC and 2.5D IC Packaging Market by Region
1.5.1 Global 3D IC and 2.5D IC Packaging Market Size Estimates and Forecasts by Region: 2016 VS 2021 VS 2030
1.5.2 North America 3D IC and 2.5D IC Packaging Estimates and Forecasts (2016-2030)
1.5.3 Europe 3D IC and 2.5D IC Packaging Estimates and Forecasts (2016-2030)
1.5.5 China 3D IC and 2.5D IC Packaging Estimates and Forecasts (2016-2030)
1.5.5 Japan 3D IC and 2.5D IC Packaging Estimates and Forecasts (2016-2030)
1.5.6 South Korea 3D IC and 2.5D IC Packaging Estimates and Forecasts (2016-2030)
2 Market Competition by Manufacturers
2.1 Global 3D IC and 2.5D IC Packaging Production Market Share by Manufacturers (2016-2021)
2.2 Global 3D IC and 2.5D IC Packaging Revenue Market Share by Manufacturers (2016-2021)
2.3 3D IC and 2.5D IC Packaging Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.4 Global 3D IC and 2.5D IC Packaging Average Price by Manufacturers (2016-2021)
2.5 Manufacturers 3D IC and 2.5D IC Packaging Production Sites, Area Served, Product Types
2.6 3D IC and 2.5D IC Packaging Market Competitive Situation and Trends
2.6.1 3D IC and 2.5D IC Packaging Market Concentration Rate
2.6.2 Global 5 and 10 Largest 3D IC and 2.5D IC Packaging Players Market Share by Revenue
2.6.3 Mergers & Acquisitions, Expansion
3 Production and Capacity by Region
3.1 Global Production of 3D IC and 2.5D IC Packaging Market Share by Region (2016-2021)
3.2 Global 3D IC and 2.5D IC Packaging Revenue Market Share by Region (2016-2021)
3.3 Global 3D IC and 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
3.4 North America 3D IC and 2.5D IC Packaging Production
3.4.1 North America 3D IC and 2.5D IC Packaging Production Growth Rate (2016-2021)
3.4.2 North America 3D IC and 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
3.5 Europe 3D IC and 2.5D IC Packaging Production
3.5.1 Europe 3D IC and 2.5D IC Packaging Production Growth Rate (2016-2021)
3.5.2 Europe 3D IC and 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
3.6 China 3D IC and 2.5D IC Packaging Production
3.6.1 China 3D IC and 2.5D IC Packaging Production Growth Rate (2016-2021)
3.6.2 China 3D IC and 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
3.7 Japan 3D IC and 2.5D IC Packaging Production
3.7.1 Japan 3D IC and 2.5D IC Packaging Production Growth Rate (2016-2021)
3.7.2 Japan 3D IC and 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
3.8 South Korea 3D IC and 2.5D IC Packaging Production
3.8.1 South Korea 3D IC and 2.5D IC Packaging Production Growth Rate (2016-2021)
3.8.2 South Korea 3D IC and 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
4 Global 3D IC and 2.5D IC Packaging Consumption by Region
4.1 Global 3D IC and 2.5D IC Packaging Consumption by Region
4.1.1 Global 3D IC and 2.5D IC Packaging Consumption by Region
4.1.2 Global 3D IC and 2.5D IC Packaging Consumption Market Share by Region
4.2 North America
4.2.1 North America 3D IC and 2.5D IC Packaging Consumption by Country
4.2.2 U.S.
4.2.3 Canada
4.3 Europe
4.3.1 Europe 3D IC and 2.5D IC Packaging Consumption by Country
4.3.2 Germany
4.3.3 France
4.3.4 U.K.
4.3.5 Italy
4.3.6 Russia
4.4 Asia Pacific
4.4.1 Asia Pacific 3D IC and 2.5D IC Packaging Consumption by Region
4.4.2 China
4.4.3 Japan
4.4.4 South Korea
4.4.5 Taiwan
4.4.6 Southeast Asia
4.4.7 India
4.4.8 Australia
4.5 Latin America
4.5.1 Latin America 3D IC and 2.5D IC Packaging Consumption by Country
4.5.2 Mexico
4.5.3 Brazil
5 Production, Revenue, Price Trend by Type
5.1 Global 3D IC and 2.5D IC Packaging Production Market Share by Type (2016-2021)
5.2 Global 3D IC and 2.5D IC Packaging Revenue Market Share by Type (2016-2021)
5.3 Global 3D IC and 2.5D IC Packaging Price by Type (2016-2021)
6 Consumption Analysis by Application
6.1 Global 3D IC and 2.5D IC Packaging Consumption Market Share by Application (2016-2021)
6.2 Global 3D IC and 2.5D IC Packaging Consumption Growth Rate by Application (2016-2021)
7 Key Companies Profiled
7.1 Taiwan Semiconductor
7.1.1 Taiwan Semiconductor 3D IC and 2.5D IC Packaging Corporation Information
7.1.2 Taiwan Semiconductor 3D IC and 2.5D IC Packaging Product Portfolio
7.1.3 Taiwan Semiconductor 3D IC and 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
7.1.4 Taiwan Semiconductor Main Business and Markets Served
7.1.5 Taiwan Semiconductor Recent Developments/Updates
7.2 Samsung Electronics
7.2.1 Samsung Electronics 3D IC and 2.5D IC Packaging Corporation Information
7.2.2 Samsung Electronics 3D IC and 2.5D IC Packaging Product Portfolio
7.2.3 Samsung Electronics 3D IC and 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
7.2.4 Samsung Electronics Main Business and Markets Served
7.2.5 Samsung Electronics Recent Developments/Updates
7.3 Toshiba Corp
7.3.1 Toshiba Corp 3D IC and 2.5D IC Packaging Corporation Information
7.3.2 Toshiba Corp 3D IC and 2.5D IC Packaging Product Portfolio
7.3.3 Toshiba Corp 3D IC and 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
7.3.4 Toshiba Corp Main Business and Markets Served
7.3.5 Toshiba Corp Recent Developments/Updates
7.4 Advanced Semiconductor Engineering
7.4.1 Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Corporation Information
7.4.2 Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Product Portfolio
7.4.3 Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
7.4.4 Advanced Semiconductor Engineering Main Business and Markets Served
7.4.5 Advanced Semiconductor Engineering Recent Developments/Updates
7.5 Amkor Technology
7.5.1 Amkor Technology 3D IC and 2.5D IC Packaging Corporation Information
7.5.2 Amkor Technology 3D IC and 2.5D IC Packaging Product Portfolio
7.5.3 Amkor Technology 3D IC and 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021)
7.5.4 Amkor Technology Main Business and Markets Served
7.5.5 Amkor Technology Recent Developments/Updates
8 3D IC and 2.5D IC Packaging Manufacturing Cost Analysis
8.1 3D IC and 2.5D IC Packaging Key Raw Materials Analysis
8.1.1 Key Raw Materials
8.1.2 Key Raw Materials Price Trend
8.1.3 Key Suppliers of Raw Materials
8.2 Proportion of Manufacturing Cost Structure
8.3 Manufacturing Process Analysis of 3D IC and 2.5D IC Packaging
8.4 3D IC and 2.5D IC Packaging Industrial Chain Analysis
9 Marketing Channel, Distributors and Customers
9.1 Marketing Channel
9.2 3D IC and 2.5D IC Packaging Distributors List
9.3 3D IC and 2.5D IC Packaging Customers
10 Market Dynamics
10.1 3D IC and 2.5D IC Packaging Industry Trends
10.2 3D IC and 2.5D IC Packaging Growth Drivers
10.3 3D IC and 2.5D IC Packaging Market Challenges
10.4 3D IC and 2.5D IC Packaging Market Restraints
11 Production and Supply Forecast
11.1 Global Forecasted Production of 3D IC and 2.5D IC Packaging by Region (2022-2030)
11.2 North America 3D IC and 2.5D IC Packaging Production, Revenue Forecast (2022-2030)
11.3 Europe 3D IC and 2.5D IC Packaging Production, Revenue Forecast (2022-2030)
11.4 China 3D IC and 2.5D IC Packaging Production, Revenue Forecast (2022-2030)
11.5 Japan 3D IC and 2.5D IC Packaging Production, Revenue Forecast (2022-2030)
11.6 South Korea 3D IC and 2.5D IC Packaging Production, Revenue Forecast (2022-2030)
12 Consumption and Demand Forecast
12.1 Global Forecasted Demand Analysis of 3D IC and 2.5D IC Packaging
12.2 North America Forecasted Consumption of 3D IC and 2.5D IC Packaging by Country
12.3 Europe Market Forecasted Consumption of 3D IC and 2.5D IC Packaging by Country
12.4 Asia Pacific Market Forecasted Consumption of 3D IC and 2.5D IC Packaging by Region
12.5 Latin America Forecasted Consumption of 3D IC and 2.5D IC Packaging by Country
13 Forecast by Type and by Application (2022-2030)
13.1 Global Production, Revenue and Price Forecast by Type (2022-2030)
13.1.1 Global Forecasted Production of 3D IC and 2.5D IC Packaging by Type (2022-2030)
13.1.2 Global Forecasted Revenue of 3D IC and 2.5D IC Packaging by Type (2022-2030)
13.1.3 Global Forecasted Price of 3D IC and 2.5D IC Packaging by Type (2022-2030)
13.2 Global Forecasted Consumption of 3D IC and 2.5D IC Packaging by Application (2022-2030)
14 Research Finding and Conclusion
15 Methodology and Data Source
15.1 Methodology/Research Approach
15.1.1 Research Programs/Design
15.1.2 Market Size Estimation
15.1.3 Market Breakdown and Data Triangulation
15.2 Data Source
15.2.1 Secondary Sources
15.2.2 Primary Sources
15.3 Author List
15.4 Disclaimer
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Market Research Process
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Case Study- Automotive Sector
One of the key manufacturers of automotive had plans to invest in electric utility vehicles. The electric cars and associated markets being a of evolving nature, the automotive client approached Straits Research for a detailed insight on the market forecasts. The client specifically asked for competitive analysis, regulatory framework, regional prospects studied under the influence of drivers, challenges, opportunities, and pricing in terms of revenue and sales (million units).
Solution
The overall study was executed in three stages, intending to help the client meet its objective of precisely understanding the entire market before deciding on an investment. At first, secondary research was conducted considering political, economic, social, and technological parameters to get a gist of the various aspects of the market. This stage of the study concluded with the derivation of drivers, opportunities, and challenges. It also laid substantial emphasis on understanding and collecting data not only on a global scale but also on the regional and country levels. Data Extraction through Primary Research
The second stage involved primary research in which several market players and automotive parts suppliers were contacted to study their viewpoint concerning the development of their market and production capacity, clientele, and product line. This stage concluded in a brief understanding of the competitive ecosystem and also glanced through the strategies and pricing of the companies profiled.
Market Estimates and Forecast
In the final stage of the study, market forecasts for the electric utility were derived using multiple market engineering approaches. This data helped the client to get an overview of the market and accelerate the process of investment.
Case Study- ICT Sector
Business process outsourcing, being one of the lucrative markets from both supply- and demand- side, has appealed to various companies. One of the prominent corporations based out of Japan approached us with their requirements regarding the scope of the procurement outsourcing market for around 50 countries. Additionally, the client also sought key players operating in the market and their revenue breakdown in terms of region and application.
Business Solution
An exhaustive market study was conducted based on primary and secondary research that involved factors such as labor costs in various countries, skilled and technical labors, manufacturing scenario, and their respective contributions in the global GDP. A comparative study of the market was conducted from both supply- and demand side, with the supply-side comprising of notable companies, such as GEP, Accenture, and others, that provide these services. On the other hand, large manufacturing companies from them demand-side were considered that opt for these services.
Conclusion
The report aided the client in understanding the market trends, including country-level business scenarios, consumer behavior, and trends in 50 countries. The report also provided financial insights of crucial players and detailed market estimations and forecasts till 2028.
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